Call for Papers
Important Dates
Paper submission deadline
July 31, 2023
Notification
September 15, 2023
Camera-ready
October 05, 2023
Author registration deadline
October 12, 2023
Call for Papers (CFP)
INTERCON (IEEE Peru Section conference) is a renowned IEEE international technical conference which has been conducted in the Peru Section, to bring exciting discoveries, knowledge & understanding together. INTERCON 2023 is the XXX version of the conference and has been themed inspired by the IEEE Future Directions platforms. Year 2023’s INTERCON is co-organized by UPC (Universidad de Ciencias Aplicadas) jointly to its IEEE UPC Student Branch. We invite you to submit technical papers for oral presentations. INTERCON 2023 will continue the footsteps of its predecessors, to serve as a great platform for researchers to discuss and explore advanced technologies in advancing humanity.
INTERCON (IEEE Peru Section conference) is a renowned IEEE international technical conference which has been conducted in the Peru Section, to bring exciting discoveries, knowledge & understanding together. INTERCON 2023 is the XXX version of the conference and has been themed inspired by the IEEE Future Directions platforms. Year 2023’s INTERCON is co-organized by UPC (Universidad de Ciencias Aplicadas) jointly to its IEEE UPC Student Branch. We invite you to submit technical papers for oral presentations. INTERCON 2023 will continue the footsteps of its predecessors, to serve as a great platform for researchers to discuss and explore advanced technologies in advancing humanity.
Topics Of Interest
Papers presenting original and innovation work in, but not limited to, the following tracks are invited for submission:
- T1. Artificial Intelligence and Machine learning
- T2. Communications and Networking
- T3. Power, Energy, and Power Electronics
- T4. Biomedical Engineering and Healthcare Technologies
- T5. Robotics, Control, Instrumentation, and Automation
- T6. Multimedia Signal Processing and Analytics
- T7. Devices, Circuits, and Materials
- T8. RF Circuits, Systems, and Antennas
- T9. Data Science and Computing Technologies
- T10. Education in Engineering and Technology
- T1. Artificial Intelligence and Machine learning
- T2. Communications and Networking
- T3. Power, Energy, and Power Electronics
- T4. Biomedical Engineering and Healthcare Technologies
- T5. Robotics, Control, Instrumentation, and Automation
- T6. Multimedia Signal Processing and Analytics
- T7. Devices, Circuits, and Materials
- T8. RF Circuits, Systems, and Antennas
- T9. Data Science and Computing Technologies
- T10. Education in Engineering and Technology
Submission Guidelines
The conference invites research papers of varying length from 6 to 8 pages (including abstract and references) and written in English. The format of the papers is based on IEEE conference template, which can be downloaded from:
https://www.ieee.org/conferences/publishing/templates.html
For all accepted papers, the authors will be asked to sign a copyright transfer on the contents of their paper(s). The accepted papers will be indexed and published on the IEEE Xplore Digital Library. All papers, only in PDF file, must be submitted electronically through the EasyChair:
INTERCON 2023 – XXX International Conference on Electronics, Electrical Engineering and Computing